IC socket 775E1060-XXX

Suitable Packages: supports BGA60 packages
Socket Pitch: 0.8mm pitch
Number Of Pins: 60 pins
Socket Design: open-top
Durability: very durable burn-in socket, at least 10000 guaranteed actuations
Manufacturer: Sensata
RoHS: RoHS Compliant
Mounting Type: surface mount, secured with screws to the PCB
Stock Availability: Out of stock, please inquire for availability

IC socket specifications

The 775E1060-XXX test socket, manufactured by Sensata, is a precision-engineered solution tailored for BGA60 packages.

, this socket is built to handle the unique requirements of semiconductor testing. It supports 60-balls BGA packages with a pitch of 0.8mm, ensuring accurate alignment and reliable contact during testing.

Crafted with an Open Top design, this socket offers ease of use and a suitable solution for autoloading equipment or robotic handlers. Its robust construction is available in a surface mount configuration, secured with screws to the PCB.

Engineered for longevity, it guarantees at least 10000 actuations (Inserting or removing the device counts as one actuation), and standard operational temperature range.

Socket drawing available upon request.

For additional information regarding this part or if you're unsure whether your package is compatible with this socket, please inquire about part number 775E1060-XXX

**775E1060-XXX** dimensions (mm):
IC dimensions				socket dimensions	pin length
A	B	C	D	G x H x I	J
-	-			-	-

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