IC socket 776A3165-XXX

Suitable Packages: supports BGA165 packages
Socket Pitch: 0.65mm pitch
Number Of Pins: 165 pins
Socket Design: open-top
Durability: very durable burn-in socket, at least 10000 guaranteed actuations
Manufacturer: Sensata
RoHS: RoHS Compliant
Mounting Type: through hole, solder-mounted on the PCB
Stock Availability: Out of stock, please inquire for availability

IC socket specifications

The 776A3165-XXX test socket, manufactured by Sensata, is a precision-engineered solution tailored for BGA165 packages.

, this socket is built to handle the unique requirements of semiconductor testing. It supports 165-balls BGA packages with a pitch of 0.65mm, ensuring accurate alignment and reliable contact during testing.

Crafted with an Open Top design, this socket offers ease of use and a suitable solution for autoloading equipment or robotic handlers. Its robust construction is available in a through hole configuration, solder-mounted on the PCB.

Engineered for longevity, it guarantees at least 10000 actuations (Inserting or removing the device counts as one actuation), and standard operational temperature range.

Socket drawing available upon request.

For additional information regarding this part or if you're unsure whether your package is compatible with this socket, please inquire about part number 776A3165-XXX

**776A3165-XXX** dimensions (mm):
IC dimensions				socket dimensions	pin length
A	B	C	D	G x H x I	J
-	-			-	-

Product rating:

Product rating: