IC socket 777B1175-101
- Suitable Packages: supports BGA175 packages
- Socket Pitch: 0.8mm pitch
- Number Of Pins: 175 pins
- Socket Design: open-top
- Durability: very durable burn-in socket, at least 10000 guaranteed actuations
- Manufacturer: Sensata
- RoHS: RoHS Compliant
- Mounting Type: through hole, solder-mounted on the PCB
- Country Of Origin: South Korea
- Stock Availability: Out of stock, please inquire for availability
The 777B1175-101 test socket, manufactured by Sensata, is a precision-engineered solution tailored for BGA175 packages.
Designed to accommodate packages with dimensions of 13mm by 13mm, this socket is built to handle the unique requirements of semiconductor testing. It supports 175-balls BGA packages with a pitch of 0.8mm, ensuring accurate alignment and reliable contact during testing.
Crafted with an Open Top design, this socket offers ease of use and a suitable solution for autoloading equipment or robotic handlers. Its robust construction is available in a through hole configuration, solder-mounted on the PCB.
Engineered for longevity, it guarantees at least 10000 actuations (Inserting or removing the device counts as one actuation), and standard operational temperature range.
Socket drawing available upon request.
For additional information regarding this part or if you're unsure whether your package is compatible with this socket, please inquire about part number 777B1175-101
| IC dimensions | socket dimensions | pin length | |||
| A | B | C | D | G x H x I | J |
| 13 | 13 | 26 x 26 | - | ||
| |||||