IC socket B1157C-B1P87
- Suitable Packages: supports BGA157 packages
- Socket Pitch: 0.65mm pitch
- Number Of Pins: 157 pins
- Socket Design: open-top
- Durability: very durable burn-in socket, at least 10000 guaranteed actuations
- Manufacturer: Okins
- RoHS: RoHS Compliant
- Mounting Type: surface mount, secured with screws to the PCB
- Country Of Origin: South Korea
- Stock Availability: Out of stock, please inquire for availability
The B1157C-B1P87 test socket, manufactured by Okins, is a precision-engineered solution tailored for BGA157 packages.
Designed to accommodate packages with dimensions of 9mm by 9mm, this socket is built to handle the unique requirements of semiconductor testing. It supports 157-balls BGA packages with a pitch of 0.65mm, ensuring accurate alignment and reliable contact during testing.
Crafted with an Open Top design, this socket offers ease of use and a suitable solution for autoloading equipment or robotic handlers. Its robust construction is available in a surface mount configuration, secured with screws to the PCB.
Engineered for longevity, it guarantees at least 10000 actuations (Inserting or removing the device counts as one actuation), and standard operational temperature range.
Socket drawing available upon request.
For additional information regarding this part or if you're unsure whether your package is compatible with this socket, please inquire about part number B1157C-B1P87
| IC dimensions | socket dimensions | pin length | |||
| A | B | C | D | G x H x I | J |
| 9 | 9 | - | - | ||
| |||||