IC socket FBGA676-027A
- Suitable Packages: supports BGA676 packages
- Socket Pitch: 1.0mm pitch
- Number Of Pins: 676 pins
- Socket Design: open-top
- Durability: very durable burn-in socket, at least 10000 guaranteed actuations
- Manufacturer: TI
- RoHS: RoHS Compliant
- Mounting Type: through hole, solder-mounted on the PCB
- Country Of Origin: China
- Stock Availability: In stock for quick delivery
The FBGA676-027A test socket, manufactured by TI, is a precision-engineered solution tailored for BGA676 packages.
Designed to accommodate packages with dimensions of 27mm by 27mm and a height of 2.22mm, this socket is built to handle the unique requirements of semiconductor testing. It supports 676-balls BGA packages with a pitch of 1.0mm, ensuring accurate alignment and reliable contact during testing.
Crafted with an Open Top design, this socket offers ease of use and a suitable solution for autoloading equipment or robotic handlers. Its robust construction is available in a through hole configuration, solder-mounted on the PCB.
Engineered for longevity, it guarantees at least 10000 actuations (Inserting or removing the device counts as one actuation), and standard operational temperature range.
Socket drawing available upon request.
For additional information regarding this part or if you're unsure whether your package is compatible with this socket, please inquire about part number FBGA676-027A
| IC dimensions | socket dimensions | pin length | |||
| A | B | C | D | G x H x I | J |
| 27 | 27 | - | 2.0 | ||
| |||||