IC socket HSB04-0025G1
- Suitable Packages: supports BGA25 packages
- Socket Pitch: 0.4mm pitch
- Number Of Pins: 25 pins
- Socket Design: open-top
- Durability: very durable burn-in socket, at least 10000 guaranteed actuations
- Manufacturer: HiCon
- RoHS: RoHS Compliant
- Stock Availability: Out of stock, please inquire for availability
The HSB04-0025G1 test socket, manufactured by HiCon, is a precision-engineered solution tailored for BGA25 packages.
Designed to accommodate packages with dimensions of 2.492mm by 2.546mm, this socket is built to handle the unique requirements of semiconductor testing. It supports 25-balls BGA packages with a pitch of 0.4mm, ensuring accurate alignment and reliable contact during testing.
Crafted with an Open Top design, this socket offers ease of use and a suitable solution for autoloading equipment or robotic handlers. Its robust construction is available in a through hole configuration, solder-mounted on the PCB.
Engineered for longevity, it guarantees at least 10000 actuations (Inserting or removing the device counts as one actuation), and standard operational temperature range.
Socket drawing available upon request.
For additional information regarding this part or if you're unsure whether your package is compatible with this socket, please inquire about part number HSB04-0025G1
| IC dimensions | socket dimensions | pin length | |||
| A | B | C | D | G x H x I | J |
| 2.492 | 2.546 | - | - | ||
| |||||