IC socket QFN-10(20)BT-0.5-02

The QFN-10(20)BT-0.5-02 test socket, manufactured by Enplas, is a precision-engineered solution tailored for QFN10 packages.
IC socket QFN QFN-10(20)BT-0.5-02 is depopulated version of QFN-20BT-0.5-02
QFN-10(20)BT-0.5-02 is assembled with ground pin.

Designed to accommodate packages with dimensions of 3mm by 3mm and a height of 0.75mm, this socket is built to handle the unique requirements of semiconductor testing. It supports 10-pins QFN packages with a pitch of 0.5mm, ensuring accurate alignment and reliable contact during testing.

Featuring a Clam-Shell design, this socket ensures a secure and stable connection during testing and higher variability of package thickness acceptance. Its hinged mechanism allows for effortless manual operation, making it ideal for frequent device insertion and removal. Its robust construction is available in a through hole configuration, solder-mounted on the PCB.

IC socket QFN QFN-10(20)BT-0.5-02 is equipped with a ground pin, which serves a critical role in enhancing signal integrity and mitigating electrical interference during testing. Ground pins are commonly used to provide a low-impedance path to ground, ensuring stable signal reference points and reducing noise that may impact testing accuracy. By maintaining a reliable ground connection, the socket delivers improved performance, particularly for high-frequency and sensitive applications.

Engineered for longevity, it guarantees at least 10000 actuations (Opening and closing the lid counts as one actuation), and an operational temperature range of -65.00°C to 150.00°C

Socket drawing available upon request.

For additional information regarding this part or if you're unsure whether your package is compatible with this socket, please inquire about part number QFN-10(20)BT-0.5-02